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ENASE 2016 will be held in conjunction with ICEIS 2016 and GISTAM 2016.
Registration to ENASE allows free access to the ICEIS and GISTAM conferences (as a non-speaker).

Upcoming Deadlines

Regular Paper Submission Extension: December 10, 2015
Regular Paper Authors Notification: February 3, 2016
Regular Paper Camera Ready and Registration: February 18, 2016
The mission of ENASE (Evaluation of Novel Approaches to Software Engineering) is to be a prime international forum to discuss and publish research findings and IT industry experiences with relation to the evaluation of novel approaches to software engineering. The conference acknowledges necessary changes in systems and software thinking due to contemporary shifts of computing paradigm to e-services, cloud computing, mobile connectivity, business processes, and societal participation.
By comparing novel approaches with established traditional practices and by evaluating them against systems and software quality criteria, ENASE conferences advance knowledge and research in software engineering, including and emphasizing service-oriented, business-process driven, and ubiquitous mobile computing. ENASE aims at identifying most hopeful trends and proposing new directions for consideration by researchers and practitioners involved in large-scale systems and software development, integration, deployment, delivery, maintenance and evolution.

Conference Chair

Joaquim FilipePolytechnic Institute of Setúbal / INSTICC, Portugal


Leszek MaciaszekWroclaw University of Economics, Poland and Macquarie University, Sydney, Australia

Keynote Lectures

Sergio GusmeroliTXT e-solutions SPA, Italy
Wil Van Der AalstTechnische Universiteit Eindhoven, Netherlands
Ernesto DamianiEBTIC-KUSTAR, United Arab Emirates


Submission: February 16, 2016

All papers presented at the conference venue
will be available at the SCITEPRESS Digital Library

It is planned to publish a short list of revised and
extended versions of presented papers with Springer
in a CCIS Series book (final approval pending)

In Cooperation with:


Proceedings will be submitted for indexation by:

Thomson   INSPEC   DBLP   EI   SCOPUS