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ENASE 2018 will be held in conjunction with ICEIS 2018 and ICT4AWE 2018.
Registration to ENASE allows free access to the ICEIS and ICT4AWE conferences (as a non-speaker).


Upcoming Deadlines

Position Paper Submission Extension: December 6, 2017
Regular Paper Authors Notification: December 19, 2017
Regular Paper Camera Ready and Registration: January 4, 2018
Position Paper Authors Notification: January 11, 2018
Position Paper Camera Ready and Registration: January 24, 2018
The mission of ENASE (Evaluation of Novel Approaches to Software Engineering) is to be a prime international forum to discuss and publish research findings and IT industry experiences with relation to novel approaches to software engineering. The conference acknowledges evolution in systems and software thinking due to contemporary shifts of computing paradigm to e-services, cloud computing, mobile connectivity, business processes, and societal participation. By publishing the latest research on novel approaches to software engineering and by evaluating them against systems and software quality criteria, ENASE conferences advance knowledge and research in software engineering, including and emphasizing service-oriented, business-process driven, and ubiquitous mobile computing. ENASE aims at identifying most hopeful trends and proposing new directions for consideration by researchers and practitioners involved in large-scale systems and software development, integration, deployment, delivery, maintenance and evolution.

Conference Chair

Leszek MaciaszekWroclaw University of Economics, Poland and Macquarie University, Sydney, Australia

PROGRAM CO-CHAIRS

Ernesto DamianiEBTIC-KUSTAR, United Arab Emirates
George SpanoudakisCity University London, United Kingdom

Workshops

Special Sessions

Submission: January 15, 2018
 
 

All papers presented at the conference venue
will be available at the SCITEPRESS Digital Library


It is planned to publish a short list of revised and 
extended versions of presented papers with Springer
in a CCIS Series book (final approval pending)

In Cooperation with:

ACM In-Cooperation
ACM SIGAPP   ACM SIGSOFT  


Proceedings will be submitted for indexation by:

DBLP   Thomson   INSPEC   EI   SCOPUS

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